1. Home
  2. Channels
  3. IEEE Reliability Society
IEEE Reliability Society
To enjoy the benefits of IEEE:

Join / Renew Today

Off-Key And On Purpose
Nokia Bell Labs: An IEEE Milestones Event
APEC 2026 Plenary: MagNet Challenge: The Serendipity when Power Magnetics meet AI - Minjie Chen
ICRA 2025 | Robot Parade
2025 Medal of Honor
CREATING RENDERMAN®: PIXAR'S IMPACT ON COMPUTER GRAPHICS | AN IEEE MILESTONE

Advertisement

All videos

Advertisement

Showing 1 - 22 of 49
00:32:51
Submicron Nanosecond Thermoreflectance Imaging for Thermal and Failure Analysis
513 views
>
01:48:56
Tutorial: Reliability Testing and Design for Reliability of Packaging Interconnects
612 views
>
00:39:52
Quality and Reliability Assessment of Sintered Nanoporous-Copper Interconnects on Substrates
27 views
>
00:20:31
Numerical Investigation of Impinging Surface Enhancement with Copper Inverse Opals (CIO) for Jet Cooling
457 views
>
00:41:32
Interconnect Reliability: From the Chip to the System
83 views
>
00:48:02
Reliability Outlook and Challenges for Monolithic SiPh Applications in Foundary Viewpoint
78 views
>
00:25:38
Failure-Oriented-Accelerated-Tests (FOATs) and their Roles in Making a Viable IC Package into a Reliable Product
12 views
>
00:23:00
Multiphysics Approach to Reliability Prediction of Integrated Circuits Due to Radiation Induced Failures
21 views
>
00:26:30
Mars 2020 Perseverance Rover: Thermal Cycle Life Qualification
14 views
>
00:21:06
FE-Modeling Validation of Innolot Deformation Behavior with TMF Testing under Cyclic Shear-Dominant Thermomechanical Loading
6 views
>
00:22:55
Addressing Thermal Challenges for Co-packaging Processes on Glass Substrates
32 views
>
00:40:08
Low Melting Temperature Solder Interconnect Thermo-mechanical Performance, Stability, and Degradation Mechanism
56 views
>
00:48:01
Reliability Challenges of Advanced Silicon Photonics Devices
153 views
>
00:39:38
Heterogeneous Integration Roadmap Update: Chapter on Reliability
54 views
>
00:45:06
Heterogeneous Integration: Packaging Opportunities and Challenges – A Reliability Perspective
115 views
>
00:24:27
Baking Time Study for Moisture-Sensitive Packages
44 views
>
00:13:30
Investigation of Thermal-Fatigue Properties of SnBiAgCu Solder Alloys
27 views
>
00:23:10
Nonlocal Damage Modeling of Solder Joint Failure under Thermal and Thermomechanical cyclic Loading
30 views
>
00:24:11
Mechanical and Condensation Challenges for Autonomous Vehicle Reliability
23 views
>
00:36:53
Silicon Photonics Reliability Requirements for Datacom and Telecom Applications
244 views
>
00:09:46
Welcome: IEEE/EPS Symposium on Reliability for Electronics and Photonics Packaging (2022)
38 views
>
00:09:20
Welcome: IEEE/EPS Symposium on Reliability for Electronics and Photonics Packaging
18 views
>
Showing 1 - 22 of 49

Advertisement